Ambient temperature may cause various faults to the end board. The main reasons include:

Overheating leads to short circuit or overload: In a high temperature environment, the internal components of the end board may expand due to heat, resulting in poor contact or reduced insulation, causing short circuit or overload, thereby causing circuit failure.

Temperature changes cause material aging: Rapid changes in ambient temperature may cause materials in the end board to age, such as sealing glue, insulation materials, etc., causing them to lose their original insulation properties, causing leakage and other faults.

Affected electronic component performance: Under extreme temperature conditions, the performance of electronic components may be affected, resulting in reduced circuit stability or even failure.

Humidity problem inside the end board: In a high-temperature environment, a large amount of moisture may be generated inside the end board, resulting in a decrease in insulation performance and increasing the risk of leakage and short circuit.

To sum up, the possible failures of the end board caused by ambient temperature are mainly caused by poor contact or short circuit caused by thermal expansion and contraction, material aging, and performance degradation of electronic components. Therefore, to ensure the normal operation of the end board, the ambient temperature needs to be considered and controlled.